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Rigid-Flexible PCB

 

 

Rigid-Flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

 

Rigid-Flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

1. Space requirements can be minimized by applying 3D

2. By removing the need for connectors and cables between the individual rigid parts, the board size and overall system weight can be reduced.

3. By maximizing space, there is often a lower count in parts.

4. Fewer solder joints assure higher connection reliability.

5. Handling during assembly is easier in comparison with flexible boards.

6. Simplified PCB assembly processes.

7. Integrated ZIF contacts provide simple modular interfaces to the system environment.

8. Test conditions are simplified. A complete test before installation becomes possible.

9. Logistical and assembly costs are significantly reduced with Rigid-Flex boards.

10. It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.

 

Parameter	Capability
Layers	32 Layers
Min Track / Spacing	0.075 mm/ 0.075 mm
Min Hole Size / Pad Size	0.10 mm/ 0.35 mm
Rigid-Flex Thickness	0.25 mm-6.0 mm
Max Copper Thickness	4 oz
Max WPNL Size	610 mm X 914 mm
Finish Copper(Flex Part)	0.5-2 oz
Finish Copper(Rigid Part)	1-4 oz
Max Aspect Ratio	13:1
Surface Finish	ENIG, Electric gold, IM-Ag, Electric Ag, HASL, OSP
Drilling Accuracy	+/-0.05 mm
PTH Diameter Tolerance	+/-0.05 mm
Build time	7-20 days
RFQ	1-2 days

 

 

1-2L Lead-time	3-7 days
4- 8L Lead-time	7-10 days
10-18L Lead-time	10-15 days
20-28L Lead-time	15-20 days
28-32L Lead-time	30 days

 

 

 

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